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 Hollingsworth & Vose introduces ViaMat™ nonwoven aramid paper for use as core substrate in the manufacture of high-performance printed circuit boards and chip carriers. ViaMat provides low coefficient of thermal expansion (CTE) for dimensional stability making it ideal for avionics, military, medical devices, and high-capacity server applications.
ViaMat’s benefits include:
- Low CTE for dimensional stability
- Ultrasmooth surface
- Enhanced drillability
- High interconnect density
- Existing process capability
- High-performance applications
The Best Choice for PCB Reinforcement
Users of electronic devices continually demand smaller size, lighter weight, and greater functionality. Manufacturers are constantly challenged to design printed circuit boards with higher and higher interconnect densities to meet market trends. While woven glass substrates have largely met market needs, they have inherent limitations with regard to via formation and dimensional stability. Alternate technologies such as films require substantially different manufacturing and handling capabilities. Only ViaMat can meet the increased demands of today’s electronic devices while enabling processing on existing infrastructure.
To download a data sheet, click here.
To view our interview at IPC APEX EXPO 2009, click here.
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